Bearings are key precision basic components in the equipment manufacturing industry 1,2,3,4,5. The performance of bearings directly determines the performance, quality and reliability of equipment 6,7 ...

This paper presents the results from lapping experiments conducted with the use of a lapping plate fabricated by the selective laser sintering (SLS) from the polyamide PA2200 powder. The minimum ...

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...