Gain Real-World Experience: Two blocks of cooperative education provide you with hands-on, full-time paid work experience in the packaging science industry ...

Oliver Campbell, Dell Technologies’ Director of Procurement & Packaging Engineering, has been with the tech innovation vanguard for more than half the company’s 39-year existence. At that time, the ...

Packaging science goes far beyond mere protection and containment. It's a bridge between products and consumers, serving as a powerful tool for marketing, sustainability, and innovation. This is where ...

Analyst Insight: When packaging engineers are brought in late in the process, a small issue can turn into major operational problems. A recent planter redesign showed how a quarter-inch mismatch ...

Although consumers care about the products they buy, the packaging matters, too. It is a similar concern for company leaders. An insufficient package could result in goods arriving spoiled, broken or ...

This concentration is designed to equip practitioners with the tools necessary to meet tomorrow’s challenges concerning packaging and its sustainability in the associated supply chains. To this end, ...

The first student has completed the University of Nevada, Reno's Nuclear Packaging Graduate Certificate program, the only such program in the nation. Daniel Perlstein, an employee of the Nevada ...

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced ...

According to a new study by Wissen Research, the global sustainable pharmaceutical packaging market is projected to expand from USD 114.5 billion in 2025 to USD 270.4 billion by 2031, registering a ...

To engineer pharmaceutical packaging components, a deep understanding of an injectable drug's requirements and specifications, as well as its manufacturing and filling environments is crucial. In this ...

TECH’s new modular engineer-to-order platform for medical device assembly is now available on the market. Designed as a ...

This system is capable of packaging chips with a high accuracy of ±0.8μm using thermal compression bonding “TCB” on 515mm × 510mm and 600mm × 600mm panels complying with the SEMI Standards. It can ...