Fremont, CA -- Jan 13, 2014 / (http://www.myprgenie.com) -- i2a Technologies announced today the completion of its wafer UBM expansion, which will more than double ...

Hsinchu, Taiwan-based Taiwan Semiconductor Manufacturing Co. (TSMC) has qualified its wafer bumping technology for volume production, claiming it is the first dedicated foundry to deliver production, ...

MUNICH, Germany--(BUSINESS WIRE)--SUSS MicroTec (FWB:SMH) (GER:SMH) announced that it has shipped and successfully installed a 300mm production lithography tool order at Amkor Technology, Inc.

COLORADO SPRINGS, Colo.--(BUSINESS WIRE)--IC Interconnect (ICI), a wafer bumping service company, announces an agreement with Jiangyin Changdian Advanced Packaging (JCAP), a company specializing in ...

HSINCHU, Taiwan–Taiwan Semiconductor Manufacturing Co. Ltd. here today announced the start of wafer-bumping production services, which place solder contracts across the surface of processed silicon ...

JIANGYIN, China,, Sept. 15, 2017 – SJ Semiconductor Corp. (SJSemi) and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, jointly announced that SJSemi has started the qualification ...

SJ Semiconductor (SJSemi) has begun mass production of 14nm wafer bumping for Qualcomm, the companies have jointly announced. Mass production of 14nm wafer bumping in China is part of Qualcomm's ...

Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and packaging for ...

ASE develops 300mm wafer bumping technologyNews from E-InSiteAdvanced Semiconductor Engineering said it has completed the development of a 300mm wafer solder bumping technology for flip chip ...

Interconnect, a wafer bumping service company, announced qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high ...