A new light-field camera combines SPAD sensors and AI to reconstruct particle trajectories in 3D, potentially reducing the ...

Using IDS industrial cameras, the vvvv real-time platform and custom interactive media installations, the Haus der Geschichte creates participatory exhibition experiences that seamlessly connect ...

UCC33420-Q1 automotive-qualified 1.5W isolated DC-DC module from Texas Instruments. The module enables a distributed power architecture, helping engineers meet functional safety requirements by ...

Farnell is now distributing Hailo's edge AI processors, modules, and development kits through Farnell, Newark, and element14, ...

Infineon Technologies AG has introduced the RIC70115, a radiation-hardened (rad hard) GaN HEMT driver designed for satellite and high-reliability space applications where power conversion performance ...

A new metasurface chip from MIT electronically tunes infrared light without mechanical components, opening new possibilities ...

OMRON Electronic Components has rebranded as Aratas, introducing a new identity while continuing to supply the same portfolio ...

Intended to assist engineers in addressing the various interconnect challenges that they face, this is a free-of-charge remote diagnosis capability. Drawings, photos or a written description of the ...

The new eBook examines power delivery, SiC, GaN and sensing technologies supporting AI data centres, edge computing and ...

It is designed to fully demonstrate the features of the BD83070GWL DC-DC converter IC, which combines high efficiency with ultra-low current consumption. In recent years, battery-powered electronic ...

A new semiconductor terahertz chip developed by UCLA integrates signal generation and detection, bringing practical ...

New exemptions to the EU Battery Regulation mean smartwatches, fitness trackers and other wearables will not require ...