Melexis has launched the MLX81119, an 18-channel LIN RGB LED controller featuring an integrated DC/DC converter designed to simplify automotive lighting ...

Beyond quantum computing, High NA EUV lithography is also expected to play a major role in manufacturing advanced AI processors and high-performance computing chips. imec’s latest demonstration ...

Ambarella, Inc. introduced its highly integrated CV7 edge AI vision system-on-chip (SoC) with multiple functional blocks at CES 2026. The vision SoC is optimized for a wide range of AI perception ...

EMASS, a subsidiary of Nanoveu specializing in next-generation semiconductor technologies, has announced that its latest ECS-DoT system-on-chip (SoC), manufactured on an advanced 16-nm process node, ...

AMD has announced the second-generation family of its mid-range Kintex UltraScale+ field-programmable gate array (FPGA) at the Integrated Systems Europe (ISE) 2026 tech event. The new FPGA series ...

There are several techniques to build a seismic motion detector. The approach described in this article uses a simple vibration sensor, a system to amplify the signal, and an Arduino R4. However, the ...

The transition from “lead frame” designs to ICs mounted on multilayer circuit substrates with complex wiring patterns resulted in the need for advanced IC substrates, creating an urgent demand for new ...

In today’s fast-changing world of advanced semiconductor chips, getting a working product straight from a concept in the shortest time is essential, not just to stay ahead of rivals but also to help ...

The size and number of displays is one of the first indications to a new car buyer of the technological content and innovation of the vehicle. Display sizes are becoming the new horsepower in the ...

SDRs and SDNs provide fundamental tools to enable unique 5G features, such as network slicing and DSS. The world of wireless communication is about to ...

The surge in complexity of modern SoCs, driven by the integration of heterogeneous compute elements, advanced packaging techniques, and stringent power and performance demands, has led to an ...

Battery modules and packs are subjected to various stresses during their lifecycle, including electrical, thermal, and mechanical stress. A comprehensive approach to testing is needed to ensure that ...