Today, Blackmagic held its annual NAB update, and there’s a slew of new products. Grant Petty, Blackmagic CEO, always seems ...
Abstract: We bonded 70μm-thick Si chip and PI substrate with anisotropic solder paste (ASP) using laser-assisted bonding (LAB). ASP contains 5 vol.% of Sn/58Bi type 5, 6 vol.% of nonconductive PMMA ...
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