As railway systems become ever more connected and intelligent, engineers face rising pressure to deliver reliable power architectures that can support multiple vehicle platforms without increasing ...

A new light-field camera combines SPAD sensors and AI to reconstruct particle trajectories in 3D, potentially reducing the ...

Using IDS industrial cameras, the vvvv real-time platform and custom interactive media installations, the Haus der Geschichte creates participatory exhibition experiences that seamlessly connect ...

A new metasurface chip from MIT electronically tunes infrared light without mechanical components, opening new possibilities ...

The new eBook examines power delivery, SiC, GaN and sensing technologies supporting AI data centres, edge computing and ...

New exemptions to the EU Battery Regulation mean smartwatches, fitness trackers and other wearables will not require ...

However, the true performance of a BLDC motor depends heavily on its motor controller. A well-designed BLDC motor controller ...

A new optical interconnect system from Peking University uses silicon photonics and custom AI algorithms to overcome one of ...

Farnell is now distributing Hailo's edge AI processors, modules, and development kits through Farnell, Newark, and element14, ...

UCC33420-Q1 automotive-qualified 1.5W isolated DC-DC module from Texas Instruments. The module enables a distributed power architecture, helping engineers meet functional safety requirements by ...

A new semiconductor terahertz chip developed by UCLA integrates signal generation and detection, bringing practical ...

Infineon Technologies AG has introduced the RIC70115, a radiation-hardened (rad hard) GaN HEMT driver designed for satellite and high-reliability space applications where power conversion performance ...